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Hybrid Microcircuit Technology Handbook
Hybrid Microcircuit Technology Handbook
Knygos.lt klubas Knygos.lt nariams
372,60 €
-30%
Įprastai
532,29 €
  • Išsiųsime per 12–18 d.d.
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge),…
  • Leidėjas:
  • ISBN-10: 0815514239
  • ISBN-13: 9780815514237
  • Formatas: 15.2 x 22.9 x 3.3 cm, kieti viršeliai
  • Kalba: Anglų

Hybrid Microcircuit Technology Handbook (el. knyga) (skaityta knyga) | knygos.lt

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The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

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  • Autorius: James J Licari
  • Leidėjas:
  • ISBN-10: 0815514239
  • ISBN-13: 9780815514237
  • Formatas: 15.2 x 22.9 x 3.3 cm, kieti viršeliai
  • Kalba: Anglų

The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.

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