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Electronic Materials and Processes Handbook
Electronic Materials and Processes Handbook
Knygos.lt klubas Knygos.lt nariams
195,01 €
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Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct todayis cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite,…
  • Leidėjas:
  • ISBN-10: 0071634010
  • ISBN-13: 9780071634014
  • Formatas: 19.1 x 23.5 x 3.9 cm, minkšti viršeliai
  • Kalba: Anglų

Electronic Materials and Processes Handbook (el. knyga) (skaityta knyga) | knygos.lt

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Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct todayis cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design."

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  • Autorius: Charles Harper
  • Leidėjas:
  • ISBN-10: 0071634010
  • ISBN-13: 9780071634014
  • Formatas: 19.1 x 23.5 x 3.9 cm, minkšti viršeliai
  • Kalba: Anglų

Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct todayis cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design."

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