John Lau

iš viso 4
Rodoma 1-44


3D IC Integration and Packaging
3D IC Integration and Packaging John Lau
Knygos.lt nariams Knygos.lt nariams
320,31 €
-35%
492,79 €
  • Išsiųsime per 12–18 d.d.

Through-Silicon Vias for 3D Integration
Through-Silicon Vias for 3D Inte... John Lau
Knygos.lt nariams Knygos.lt nariams
250,37 €
-35%
385,19 €
  • Išsiųsime per 12–18 d.d.

Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Reliability of RoHS-Compliant 2D... John Lau
Knygos.lt nariams Knygos.lt nariams
192,91 €
-35%
296,79 €
  • Išsiųsime per 12–18 d.d.

Basics Fashion Design 09: Designing Accessories
Basics Fashion Design 09: Design... John Lau
47,59 €
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