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Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Cu-Interconnects, Glass, and AI-... John Lau, Kuo-Ning...

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473,69 €

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3D IC Integration and Packaging

3D IC Integration and Packaging John Lau

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474,49 €

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Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Inte... John Lau

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389,59 €

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Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D... John Lau

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300,19 €

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Basics Fashion Design 09: Designing Accessories

Basics Fashion Design 09: Design... John Lau

47,59 €

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