Knygos.lt nariams
228,54 €
-30%
Įprastai
326,49 €
Area Array Package Design
Knygos.lt nariams
228,54 €
-30%
Įprastai
326,49 €
- Išsiųsime per 12–18 d.d.
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
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- Autorius: Ken Gilleo
- Leidėjas: McGraw-Hill
- Metai: 2003
- ISBN-10: 0071737731
- ISBN-13: 9780071737739
- Formatas: 19.1 x 23.5 x 1.2 cm, minkšti viršeliai
- Kalba: Anglų
Atsiliepimai
Aprašymas
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Knygos.lt nariams
228,54 €
-30%
Įprastai
326,49 €
Išsiųsime per 12–18 d.d.
- Autorius: Ken Gilleo
- Leidėjas: McGraw-Hill
- Metai: 2003
- ISBN-10: 0071737731
- ISBN-13: 9780071737739
- Formatas: 19.1 x 23.5 x 1.2 cm, minkšti viršeliai
- Kalba: Anglų
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Atsiliepimai